HCS08 datasheet(348/374 Pages) NXP

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Appendix A Electrical Characteristics

MC9S08JM60 Series Data Sheet, Rev. 5

348

Freescale Semiconductor

A.4

Thermal Characteristics

This section provides information about operating temperature range, power dissipation, and package

thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in

on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take

PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or

VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy

loads), the difference between pin voltage and VSS or VDD will be very small.

Table A-2. Absolute Maximum Ratings

Rating

Symbol

Value

Unit

Supply voltage

VDD

– 0.3 to + 5.8

Input voltage

VIn

– 0.3 to VDD + 0.3

Instantaneous maximum current

Single pin limit (applies to all port pins)1, 2, 3

1 Input must be current limited to the value specified. To determine the value of the required

current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp

voltages, then use the larger of the two resistance values.

2 All functional non-supply pins are internally clamped to V

SS and VDD.

3 Power supply must maintain regulation within operating V

DD range during instantaneous and

operating maximum current conditions. If positive injection current (VIn > VDD) is greater than

IDD, the injection current may flow out of VDD and could result in external power supply going

out of regulation. Ensure external VDD load will shunt current greater than maximum injection

current. This will be the greatest risk when the MCU is not consuming power. Examples are: if

no system clock is present, or if the clock rate is very low which would reduce overall power

consumption.

± 25

Maximum current into VDD

IDD

120

Storage temperature

Tstg

–55 to +150

°C

Table A-3. Thermal Characteristics

Num

Rating

Symbol

Value

Unit

Temp.

Code

Operating temperature range (packaged)

–40 to 85

°CC

D Maximum junction temperature

135

°C

Thermal resistance

Single layer board

64-pin QFP

64-pin LQFP

48-pin QFN

44-pin LQFP

Four layer board

64-pin QFP

64-pin LQFP

48-pin QFN

44-pin LQFP

°C/W

—

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