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AD4884BBCZ bảng dữ liệu(PDF) 27 Page - Analog Devices

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Giải thích chi tiết về linh kiện  Dual-Channel 16-Bit, 20MSPS, SAR ADC with Analog Front End
PDF  116 Pages
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AD4884BBCZ bảng dữ liệu(HTML) 27 Page - Analog Devices

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Data Sheet
AD4884
THEORY OF OPERATION
analog.com
Rev. 0 | 27 of 116
PRODUCT OVERVIEW
The AD4884 is a dual-channel, 16-bit, 20MSPS per channel, SAR
ADC with integrated fully-differential drivers. It is built as a system
in package (SiP) that contains four separate die (two ADCs and
two FDAs) along with gain-setting resistors and critical decoupling
capacitors. In-package integrated components minimize the overall
solution area, reduce the potential performance errors introduced
by factors such as component selection, placement and routing
challenges, and in general reduce the engineering effort to first
design success.
The combination of a state-of-the-art ADC with a low-noise FDA
enables reaching typical SNR figures as high as 91.9dB, result
output latency of 78.13ns, and high signal fidelity for signals up
to 1MHz. This parametric performance, throughput, and bandwidth
make this product ideal for a variety of high-speed, data-acquisition
applications. Accounting for its low power consumption, the product
becomes an exceptionally apt choice for applications where chan-
nel density and thermal management present a challenge.
The external selection of the gain-setting resistors allows choosing
the gain among a set of prefixed values, while the ability to place
additional capacitors facilitates bandwidth adjustment. The FDAs
can accommodate single-ended or differential input signals, do
not require external generation of a common-mode voltage, and
generally remove common SAR ADC drive challenges such as
PCB layout, kickback settling calculations, and output filter design.
The SiP approach results in complete independence in channel
configuration and data access. For each channel, conversion result
access occurs via one of its two independent data interfaces: its
multilane LVDS port operating at clock rates up to 160MHz or via its
multioutput SPI operating at clock rates up to 50MHz.
A rich digital feature set increases the flexibility of the device
and can potentially simplify system complexity and reduce the
load on the digital host. These features include a 16,384 sample
FIFO memory per channel, internal and external event detection,
multifunction GPIOs, digital filtering, and system error correction
coefficients.
TRANSFER FUNCTION
Each AD4884 channel digitizes the full-scale difference voltage at
the input of the SAR ADC of 2 × VREFIN into 216 levels, resulting in
an LSB size of 91.55μV with VREFIN = 3.0V. Note that 1 LSB at 16
bits is approximately 15.26ppm. Note also that the transfer function
is defined at input of the ADC, not the INx±ChX pins at the input of
the AFE. The polarity is preserved in the sense that a positive value
for INx+ChX − INx−ChX results in a positive voltage measurement.
Table 7 summarizes the mapping of input voltages to differential
output codes.
Figure 49. ADC Ideal Transfer Function for the Differential Output Codes
(FSR is Full-Scale Range)
Table 7. Input Voltage to Output Code Mapping
Description
ADC Analog Input Voltage
Difference (Volts)
Digital Output Code (Twos
Complement, Hex)
FS − 1 LSB
+VREFIN × (1 − 1/215)
0x7FFF
Midscale + 1 LSB +VREFIN/215
0x0001
Midscale
0
0x0000
Midscale − 1 LSB −VREFIN/215
0xFFFF
−FS + 1 LSB
−VREFIN × (1 − 1/215)
0x8001
−FS
−VREFIN
0x8000
REFERENCE BUFFER AND COMMON-MODE
OUTPUT
The AD4884 requires an external 3.0V reference to drive the
REFIN pin. The REFIN pin integrates a capacitor array totaling
18.8μF ± 20%. The capacitor array is constructed from commercial-
ly available, multilayer, high dielectric (X6S), ceramic capacitors,
and it serves as the primary charge reservoir, which is shared by
the two SAR ADCs.
Additional external capacitance (CRSV) can optionally be placed
across the REFIN and REFGND pins for improved charge capacity
and noise rejection, as required. As with all precision circuits, the
placement of the external reference capacitors must be as close
to the device pins as possible on the same side of the PCB. The
routing between the capacitor and device pins must minimize the
series impedance in each routing path.



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