HCS08 datasheet(371/374 Pages) NXP

371 / 374 page

MC9S08JM60 Series Data Sheet, Rev. 5

Freescale Semiconductor

371

Appendix B

Ordering Information and Mechanical Drawings

B.1

Ordering Information

This section contains ordering numbers for MC9S08JM60 series devices. See below for an example of the

device numbering system.

B.2

Orderable Part Numbering System

B.3

Mechanical Drawings

This following pages contain mechanical specifications for MC9S08JM60 series package options. See

Table B-2 for the document numbers that correspond to each package type.

Table B-1. Device Numbering System

Device Number1

1 See Table 1-1 for a complete description of modules included on each device.

Memory

Available Packages2

2 See Table B-2 for package information.

Flash

RAM

Type

MC9S08JM60

60,912

4096

64-pin LQFP

64-pin QFP

48-pin QFN

44-pin LQFP

MC9S08JM32

32,768

2048

Table B-2. Package Information

Pin Count

Type

Designator

Document No.

LQFP

98ASS23225W

QFN

98ARH99048A

LQFP

98ASS23234W

QFP

98ASB42844B

Package designator

Temperature range

Family

Memory

Status

Core

Pb free indicator

(C = –40

°C to 85°C)

(MC = Fully Qualified)

(9 = Flash-based)

MC 9 S08 JM 60 C XX E

Memory size designator

(See Table B-2)

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