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HCS08 bảng dữ liệu(PDF) 262 Page - Motorola, Inc |
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HCS08 bảng dữ liệu(HTML) 262 Page - Motorola, Inc |
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262 / 290 page ![]() Electrical Characteristics MC9S08GB/GT 262 MOTOROLA A.3 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small. The average chip-junction temperature (TJ) in °C can be obtained from: Equation 1 TJ = TA + (PD ×θJA) where: TA = Ambient temperature, °C θJA = Package thermal resistance, junction-to-ambient, °C/W PD = Pint + PI/O Pint = IDD × VDD, Watts — chip internal power PI/O = Power dissipation on input and output pins — user determined For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected) is: Equation 2 PD = K ÷ (TJ + 273°C) Solving equations 1 and 2 for K gives: Equation 3 K = PD × (TA + 273°C) + θJA × (PD) 2 where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations 1 and 2 iteratively for any value of TA. Table A-2 Thermal Characteristics Rating Symbol Value Unit Temp. Code Operating temperature range (packaged) TA –40 to 85 °CC Thermal resistance 64-pin LQFP (GB60) 42-pin SDIP (GT60) 44-pin QFP (GT60) θJA 65 57 118 °C/W — |
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