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HCS08 bảng dữ liệu(PDF) 262 Page - Motorola, Inc

tên linh kiện HCS08
Giải thích chi tiết về linh kiện  Microcontrollers
PDF  290 Pages
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nhà sản xuất  MOTOROLA [Motorola, Inc]
Trang chủ  http://www.freescale.com
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HCS08 bảng dữ liệu(HTML) 262 Page - Motorola, Inc

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Electrical Characteristics
MC9S08GB/GT
262
MOTOROLA
A.3 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
The average chip-junction temperature (TJ) in °C can be obtained from:
Equation 1
TJ = TA + (PD ×θJA)
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
Equation 2
PD = K ÷ (TJ + 273°C)
Solving equations 1 and 2 for K gives:
Equation 3
K = PD × (TA + 273°C) + θJA × (PD)
2
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving equations 1 and 2 iteratively for any value of TA.
Table A-2 Thermal Characteristics
Rating
Symbol
Value
Unit
Temp.
Code
Operating temperature range (packaged)
TA
–40 to 85
°CC
Thermal resistance
64-pin LQFP (GB60)
42-pin SDIP (GT60)
44-pin QFP (GT60)
θJA
65
57
118
°C/W
—



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