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HCS08 bảng dữ liệu(PDF) 287 Page - NXP Semiconductors |
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HCS08 bảng dữ liệu(HTML) 287 Page - NXP Semiconductors |
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287 / 316 page ![]() Appendix A Electrical Characteristics MC9S08SG8 MCU Series Data Sheet, Rev. 8 Freescale Semiconductor 287 A.5 ESD Protection and Latch-Up Immunity Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM) and the charge device model (CDM). A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. Table A-4. ESD and Latch-up Test Conditions Model Description Symbol Value Unit Human Body Series resistance R1 1500 Storage capacitance C 100 pF Number of pulses per pin — 3 Latch-up Minimum input voltage limit – 2.5 V Maximum input voltage limit 7.5 V Table A-5. ESD and Latch-Up Protection Characteristics No. Rating1 1 Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. Symbol Min Max Unit 1 Human body model (HBM) VHBM 2000 — V 2 Charge device model (CDM) VCDM 500 — V 3 Latch-up current at TA = 125CILAT 100 — mA |
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