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HCS08 bảng dữ liệu(PDF) 285 Page - NXP Semiconductors

tên linh kiện HCS08
Giải thích chi tiết về linh kiện  Microcontrollers
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Appendix A Electrical Characteristics
MC9S08SG8 MCU Series Data Sheet, Rev. 8
Freescale Semiconductor
285
A.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take PI/O into account in power calculations, determine the difference between actual pin
voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
Table A-3. Thermal Characteristics
Num
C
Rating
Symbol
Value
Unit
Temp Rated1
1 Electrical characteristics only apply to the temperature rated devices marked with x.
Standar
d
AEC
Grade 0
1
—
Operating temperature range
(packaged)
TL to TH
C
C
TA
–40 to 85
x
V–40 to 105
x
M–40 to 125
x
W–40 to 150
x
2
D
Maximum junction temperature
C
CTJ
95
x
V115
x
M135
x
W155
x
D
Thermal resistance 2,3
Single-layer board
2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
3 Junction to Ambient Natural Convection
JA
Airflow at
200 ft/min
Natural
Convection
3
8-pin NB SOIC
131
153
C/W
x
16-pin TSSOP
115
135
x
x
20-pin TSSOP
95
115
x
4
D
Thermal resistance2,3
Four-layer board
JA
Airflow at
200 ft/min
Natural
Convection
8-pin NB SOIC
95
102
C/W
x
16-pin TSSOP
86
94
x
x
20-pin TSSOP
69
76
x



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