HCS08 datasheet(19/316 Pages) NXP

19 / 316 page

MC9S08SG8 MCU Series Data Sheet, Rev. 8

Freescale Semiconductor

Section Number

Title

Page

17.2.3 BDC Commands .............................................................................................................268

17.2.4 BDC Hardware Breakpoint .............................................................................................270

17.3 On-Chip Debug System (DBG) ....................................................................................................271

17.3.1 Comparators A and B .....................................................................................................271

17.3.2 Bus Capture Information and FIFO Operation ...............................................................271

17.3.3 Change-of-Flow Information ..........................................................................................272

17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................272

17.3.5 Trigger Modes .................................................................................................................273

17.3.6 Hardware Breakpoints ....................................................................................................275

17.4 Register Definition ........................................................................................................................275

17.4.1 BDC Registers and Control Bits .....................................................................................275

17.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................277

17.4.3 DBG Registers and Control Bits .....................................................................................278

Appendix A

Electrical Characteristics

A.1 Introduction ...................................................................................................................................283

A.2 Parameter Classification ................................................................................................................283

A.3 Absolute Maximum Ratings ..........................................................................................................283

A.4 Thermal Characteristics .................................................................................................................285

A.5 ESD Protection and Latch-Up Immunity ......................................................................................287

A.6 DC Characteristics .........................................................................................................................288

A.7 Supply Current Characteristics ......................................................................................................293

A.8 External Oscillator (XOSC) Characteristics .................................................................................297

A.9 Internal Clock Source (ICS) Characteristics .................................................................................299

A.10 Analog Comparator (ACMP) Electricals ......................................................................................301

A.11 ADC Characteristics ......................................................................................................................302

A.12 AC Characteristics .........................................................................................................................305

A.12.1 Control Timing ...............................................................................................................305

A.12.2 TPM/MTIM Module Timing ..........................................................................................307

A.12.3 SPI ...................................................................................................................................308

A.13 FLASH Specifications ...................................................................................................................311

A.14 EMC Performance .........................................................................................................................312

A.14.1 Radiated Emissions .........................................................................................................312

Appendix B

Ordering Information and Mechanical Drawings

B.1 Ordering Information ....................................................................................................................313

B.1.1 Device Numbering Scheme ............................................................................................313

B.2 Mechanical Drawings ....................................................................................................................314

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