HCS08 datasheet(283/290 Pages) MOTOROLA

283 / 290 page

Data Sheet — MC9S08GB60/D V1.5

MOTOROLA

283

MC9S08GB/GT

Appendix B Ordering Information and Mechanical

Drawings

B.1 Ordering Information

This section contains ordering numbers for MC9S08GB60, MC9S08GB32, MC9S08GT60, and

MC9S08GT32 devices. See below for an example of the device numbering system.

Temperature and package designators:

C = –40

°C to 85°C

FU = 64-pin Low Quad Flat Package (LQFP)

FB = 44-pin Quad Flat Package (QFP)

B = 42-pin Skinny Dual In-Line Package (SDIP)

MC = Fully qualified

B.2 Mechanical Drawings

This appendix contains mechanical specifications for MC9S08GB/GT MCU.

Table 15-4

MC Order Number

FLASH

Memory

RAM

TPM

Available

Package

Type

(Part Number

Suffix)

MC9S08GB60

60K

One 3-channel and one

5-channel 16-bit timer

64 LQFP (FU)

MC9S08GB32

32K

One 3-channel and one

5-channel 16-bit timer

64 LQFP (FU)

MC9S08GT60

60K

Two 2-channel/16-bit timers

44 QFP (FB)

42 SDIP (B)

MC9S08GT32

32K

Two 2-channel/16-bit timers

44 QFP (FB)

42 SDIP (B)

MC 9 S08 GB60 C XX

Package designator

Temperature range

Family

Memory

Status

Core

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