TMS320VC5502 datasheet(182/189 Pages) TI

182 / 189 page

www.ti.com

Mechanical Data

6.1

Package Thermal Resistance Characteristics

TMS320VC5502

Fixed-Point Digital Signal Processor

SPRS166H – APRIL 2001 – REVISED NOVEMBER 2004

Some TMX samples were shipped in the GGW package. For more information on the GGW package, see

the TMS320VC5502 and TMS320VC5501 Digital Signal Processors Silicon Errata (literature number

SPRZ020D or later).

TMS320VC5502PGF has completed Temp Cycle reliability qualification testing with no failures through

1500 cycles of –55

°C to 125°C following an EIA/JEDEC Moisture Sensitivity Level 4 pre-condition at

220+5/–0

°C peak reflow. Exceeding this peak reflow temperature condition or storage and handling

requirements may result in either immediate device failure post-reflow, due to package/die material

delamination (“popcorning”), or degraded Temp cycle life performance.

Please note that Texas Instruments (TI) also provides MSL, peak reflow and floor life information on a

bar-code label affixed to dry-pack shipping bags. Shelf life, temperature and humidity storage conditions

and re-bake instructions are prominently displayed on a nearby screen-printed label.

Table 6-1 and Table 6-2 provide the thermal resistance characteristics for the recommended package

types used on the TMS320VC5502 DSP.

NOTE

Some TMX samples were shipped in the GGW package. For more information on the

GGW package, see the TMS320VC5502 and TMS320VC5501 Digital Signal Processors

Silicon Errata (literature number SPRZ020D or later).

Table 6-1. Thermal Resistance Characteristics (Ambient)

PACKAGE

RΘJA (°C/W)

BOARD TYPE(1)

AIRFLOW (LFM)

High-K

150

High-K

250

High-K

500

(Without thermal vias)

117

Low-K

114

Low-K

150

GZZ, ZZZ

109

Low-K

250

101

Low-K

500

High-K

150

(With thermal vias)(2)

High-K

250

High-K

500

(1)

Board types are as defined by JEDEC. Reference JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package

Thermal Measurements.

(2)

Adding thermal vias will significantly improve the thermal performance of the device. To use the thermal balls on the GZZ and ZZZ

packages:

•

An array of 25 land pads must be added on the top layer of the PCB where the package will be mounted.

•

The PCB land pads should be the same diameter as the vias in the package substrate for optimal Board Level Reliability

Temperature Cycle performance.

•

The land pads on the PCB should be connected together and to PCB through-holes. The PCB through-holes should in turn be

connected to the ground plane for heat dissipation.

•

A solid internal plane is preferred for spreading the heat.

Refer to the MicroStar BGA™ Packaging Reference Guide (literature number SSYZ015) for guidance on PCB design, surface mount,

and reliability considerations.

182

Mechanical Data

TMS320VC5502 bảng dữ liệu(PDF) 182 Page - Texas Instruments

TMS320VC5502 bảng dữ liệu(HTML) 182 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

bảng dữ liệu tải về

Link URL