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SPC574K72E5 bảng dữ liệu(PDF) 107 Page - STMicroelectronics

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SPC574Kxx
Electrical characteristics
126
3.17.4.2
TxD
Figure 42. TxD signal
dCCTxD50%
TxD
dCCTxDFALL
dCCTxDRISE
20
50 %
80 %
Table 58. TxD output characteristics(1)(2)
Symbol
C
Characteristic
Value
Unit
Min
Max
dCCTxAsym
CC
D
Asymmetry of sending CC at 25 pF load
(= dCCTxD50%  100 ns)
–2.45
2.45
ns
dCCTxDRISE25+dCCTxDFALL25 CC
D
Sum of Rise and Fall time of TxD signal at the
output pin(3),(4)
—9(5)
ns
D—
9(6)
dCCTxD01
CC
D
Sum of delay between Clk to Q of the last FF and
the final output buffer, rising edge
—25
ns
dCCTxD10
CC
D
Sum of delay between Clk to Q of the last FF and
the final output buffer, falling edge
—25
ns
1.
TxD pin load maximum 25 pF.
2.
Specifications valid according to FlexRay EPL 3.0.1 standard with 20%–80% levels and a 10pF load at the end of a
50 Ohm, 1 ns stripline. Please refer to the Very Strong I/O pad specifications.
3.
Pad configured as VERY STRONG.
4.
Sum of transition time simulation is performed according to Electrical Physical Layer Specification 3.0.1 and the entire
temperature range of the device has been taken into account.
5. VDD_HV_IO = 5.0 V ± 10%, Transmission line Z = 50 ohms, tdelay = 1 ns, CL = 10 pF
6. VDD_HV_IO = 3.3 V ± 10%, Transmission line Z = 50 ohms, tdelay = 0.6 ns, CL = 10 pF



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