XM33C321ASPZR datasheet(97/122 Pages) TI2

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10.4 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

The following documents describe the MSPM33 MCUs. Copies of these documents are available on the Internet

at www.ti.com.

Technical Reference Manual

MSPM33C3x 160-

MHz Microcontrollers

Technical Reference

Manual

This manual describes the modules and peripherals of the MSPM33C family of devices.

Each description presents the module or peripheral in a general sense. Not all features

and functions of all modules or peripherals are present on all devices. In addition,

modules or peripherals can differ in their exact implementation on different devices. Pin

functions, internal signal connections, and operational parameters differ from device to

device. See the device-specific data sheet for these details.

10.5 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.6 Trademarks

Code Composer Studio™ and TI E2E™ are trademarks of Texas Instruments.

Arm®, Cortex®, and TrustZone® are registered trademarks of Arm Limited.

All trademarks are the property of their respective owners.

10.7 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.8 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from December 1, 2025 to September 30, 2026 (from Revision * (December 2025) to

Revision A (September 2026))

Page

• Added sleep and stop low-power modes, updated run and standby mode values............................................ 1

• Updated description of TRNG and ADC.............................................................................................................1

• Added YSG package details...............................................................................................................................1

• Updated block diagram with correct peripheral names and bus description...................................................... 4

• Fixed pin formatting and UNICOMM Pin Type. Modified ADC signal names..................................................... 7

• Updated electrical Specification for final characterization and production release ..........................................42

• Operating modes have been updated in the table Supported Functionality by Operating Modes for different

sub-systems .....................................................................................................................................................63

• Clarified secure/non-secure memory map, updated NVIC Interrupt map.........................................................63

www.ti.com

MSPM33C321A, MSPM33C3219

SLASFB6A – DECEMBER 2025 – REVISED SEPTEMBER 2026

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Product Folder Links: MSPM33C321A MSPM33C3219

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