XM33C321ASPZR datasheet(3/122 Pages) TI2

3 / 122 page

CAUTION

System-level ESD protection must be applied in compliance with the device-level ESD specification

to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level

ESD Considerations for more information. The principles in this application note are applicable to

MSPM33C MCUs.

Table 3-1. Device Information

DEVICE NAME

PACKAGE1

PACKAGE SIZE(2)

MSPM33C321ASPZR

PZ (LQFP, 100)

16mm x 16mm

MSPM33C3219SPZR(3)

MSPM33C321ASPFAR(3)

PFA (LQFP, 100)

14mm x 14mm

MSPM33C3219SPFAR(3)

MSPM33C321ASZAWR

ZAW (nFBGA, 100)

9mm x 9mm

MSPM33C3219SZAWR(3)

MSPM33C321ASPNR(3)

PN (LQFP, 80)

14mm x 14mm

MSPM33C3219SPNR(3)

MSPM33C321ASYSGR(3)

YSG (WCSP, 79)

3.6mm x 3.24mm

MSPM33C3219SYSGR(3)

MSPM33C321ASPMR(3)

PM (LQFP, 64)

12mm x 12mm

MSPM33C3219SPMR(3)

MSPM33C321ASRGZR(3)

RGZ( VQFN, 48)

7mm x 7mm

MSPM33C3219SRGZR(3)

(1)

For more information about the device name, see Device Nomenclature

(2)

The package size (length x width) is a nominal value and includes pins, where applicable

(3)

PRODUCT PREVIEW only

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MSPM33C321A, MSPM33C3219

SLASFB6A – DECEMBER 2025 – REVISED SEPTEMBER 2026

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