XM33C321ASPZR datasheet(46/122 Pages) TI2

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over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

tERASE (SEC)

Sector erase time

<10k erase/program cycles

200

tERASE (BANK)

Bank erase time

<10k erase/program cycles

220

(1)

Data flash with high erase/program cycle endurance can be used for EEPROM emulation.

(2)

Total number of cumulative erase operations supported by the flash before failure. A sector erase or bank erase operation is

considered to be one erase operation.

(3)

Maximum number of write operations allowed per word line (256 bytes) before the word line must be erased. If additional writes to the

same word line are required, a sector erase is required once the maximum number of write operations per word line is reached.

(4)

Program time is defined as the time from when the program command is triggered until the command completion interrupt flag is set in

the flash controller.

(5)

Sector program time is defined as the time from when the first word program command is triggered until the final word program

command completes and the interrupt flag is set in the flash controller. This time includes the time needed for software to load each

flash word (after the first flash word) into the flash controller during programming of the sector.

(6)

Flash word size is 128 data bits (16 bytes). On devices with ECC, the total flash word size is 144 bits (128 data bits plus 16 ECC bits).

7.7 Power Supply Sequencing

7.7.1 Power Supply Ramp

Figure 7-1 shows the relationships of POR-, POR+, BOR0-, and BOR0+ during powerup and powerdown.

POR

BOR

Running

BOR

POR BOR

Running

POR-

POR+

BOR0-

BOR0+

No reset

asserted

BOR

asserted

POR

asserted

BOR

released

POR

released

POR

released

BOR

released

Time (t)

POR/BOR levels are met

for specified |dVDD/dt|

BOR

released

Figure 7-1. Power Cycle POR and BOR Conditions

7.7.2 POR and BOR

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VDD

Power supply range

1.71

3.6

dVDD/dt

VDD (supply voltage) slew rate

Rising

0.1

V/µs

Falling (1)

0.01

Falling, STANDBY

0.1

V/ms

VPOR+

Power-on reset voltage level

Rising

0.95

1.30

1.59

VPOR-

Falling

0.9

1.25

1.53

VHYS, POR

POR hysteresis

VBOR0+,

COLD

Brown-out reset voltage level 0 (default level)

Cold start, rising

1.5

1.6

1.7

VBOR0+

Rising (1)

1.625

1.66

1.695

VBOR0-

Falling (1)

1.61

1.645

1.68

VBOR0, STBY

STANDBY mode

1.54

1.625

1.69

MSPM33C321A, MSPM33C3219

SLASFB6A – DECEMBER 2025 – REVISED SEPTEMBER 2026

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