GRM0332C2A6R9DA01 datasheet(85/89 Pages) MURATA1

85 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

286

Notice

LLM

2.0g1.25

(in mm)

Chip

(LgW)

0.6 to 0.8

(0.3 to 0.5)

b, b'

0.3

c, c'

2.0 to 2.6

1.3 to 1.8

1.4 to 1.6

0.5

Table 5 LLM Series Reﬂow Soldering Method

b=(c-e)/2, b'=(d-f)/2

[Land for LLA Series]

[Land for LLM Series]

Solder Resist

Chip Capacitor

Land

2-2. Dimensions of Slit (Example)

Preparing the slit helps ﬂux cleaning and resin

coating on the back of the capacitor.

However, the length of the slit design should be as

short as possible to prevent mechanical damage in

the capacitor.

A longer slit design might receive more severe

mechanical stress from the PCB.

Recommended slit design is shown in the Table.

1.6g0.8

2.0g1.25

3.2g1.6

3.2g2.5

4.5g2.0

4.5g3.2

5.7g2.8

5.7g5.0

–

1.0 to 2.0

1.0 to 2.8

1.0 to 4.0

–

3.2 to 3.7

4.1 to 4.6

3.6 to 4.1

4.8 to 5.3

4.4 to 4.9

6.6 to 7.1

LgW

(in mm)

Land

Solder Resist

Chip Capacitor

Slit

Series

Chip Dimension Code

(L/W)

Continued from the preceding page.

Continued on the following page.

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