GRM0332C2A6R9DA01 datasheet(74/89 Pages) MURATA1

74 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

275

Caution

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder ﬁllet should be lower than the

thickness of the components. If the solder amount is

excessive, the risk of cracking is higher during board

bending or any other stressful condition.

[Example of Temperature Conditions for Flow Soldering]

[Allowable Flow Soldering Temperature and Time]

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Soldering Time (s)

260

270

280

250

240

230

220

Up to Chip Thickness

Adhesive

Recommended Conditions

Soldering Peak Temperature

Atmosphere

Pb-Sn Solder

240 to 250°C

Air

Lead Free Solder

250 to 260°C

Preheating Peak Temperature

90 to 110°C

100 to 120°C

140 to 160°C (

NFM)

Air or N2

30-90 seconds

5 seconds max.

∆T

Gradual

Cooling

Soldering

Preheating

Peak

Temperature

Time

Temperature (°C)

Soldering

Peak

Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

4-2. Flow Soldering

1. Do not apply ﬂow soldering to chips not listed in table 2.

2. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both of the components and the PCB.

Preheating conditions are shown in table 2. It is required

to keep the temperature dierential between the solder

and the components surface (∆T) as low as possible.

3. Excessively long soldering time or high soldering

temperature can result in leaching of the terminations,

causing poor adhesion or a reduction in capacitance value

due to loss of contact between the inner electrodes and

terminations.

4. When components are immersed in solvent aer

mounting, be sure to maintain the temperature

dierential (∆T) between the component and solvent

within the range shown in the table 2.

in section

GR3/GRM

GQM

LLL

GRJ

NFM

18/21/31

18/21

21/31

18/21/31

3D/31/41

∆T<=150°C

Series

Chip Dimension

Code (L/W)

Temperature

Dierential

Table 2

Continued from the preceding page.

Continued on the following page.

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