GRM0332C2A6R9DA01 datasheet(73/89 Pages) MURATA1

73 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

274

Caution

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to

the PCB.

4. Optimum Solder Amount for Reﬂow Soldering

4-1. Overly thick application of solder paste results in a

excessive solder ﬁllet height.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause the

chips to crack.

4-2. Too little solder paste results in a lack of adhesive

strength on the termination, which may result in

chips breaking loose from the PCB.

4-3. Please conﬁrm that solder has been applied

smoothly to the termination.

Continued from the preceding page.

Continued on the following page.

100-150µm: NFM15/18/21/3D/31

100-200µm: NFM41

[Guideline of solder paste thickness]

2.5

4.4

1.0

NFM21PS

2.5

3.9

1.0

NFM3DCC/3DPC

NFM31PC/31KC

NFM18PS

3.5

5.5

1.5

NFM41CC/41PC

NFM15CC/15PC

2.2

1.0

0.4

NFM18CC/18PC

NFM21CC/21PC

1.4

2.6

0.6

0.8

1.2

0.05

2.0

1.6

1.2

2.6

1.8

0.8

0.25

0.7

1.3

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