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TMS320DM355CZCEA13 bảng dữ liệu(PDF) 159 Page - Texas Instruments

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TMS320DM355CZCEA13 bảng dữ liệu(HTML) 159 Page - Texas Instruments

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TMS320DM355
www.ti.com
SPRS463G – SEPTEMBER 2007 – REVISED JUNE 2010
6
Mechanical Data
The following table(s) show the thermal resistance characteristics for the PBGA
− ZCE mechanical
package.
Note
that
micro-vias
are
not
required.
Contact
your
TI
representative
for
routing
recommendations.
6.1
Thermal Data for ZCE
The following table shows the thermal resistance characteristics for the PBGA
− ZCE mechanical
package.
Table 6-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]
NO.
°C/W(1)
1
R
ΘJC
Junction-to-case
7.2
2
R
ΘJB
Junction-to-board
11.4
3
R
ΘJA
Junction-to-free air
27.0
4
PsiJT
Junction-to-package top
0.1
5
PsiJB
Junction-to-board
11.3
(1)
The junction-to-case measurement was conducted in a JEDEC defined 2S2P system and will change based on environment as well as
application. For more information, see these three EIA/JEDEC standards:
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
6.2
Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Note that micro-vias are not required for this package.
Copyright © 2007–2010, Texas Instruments Incorporated
Mechanical Data
159
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Product Folder Link(s): TMS320DM355



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