TMS320DM355CZCEA13 datasheet(58/163 Pages) TI1

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DM355

PREFIX

TMS 320

DM355

ZCE

TMX = Experimental device

TMS = Qualified device

DEVICE FAMILY

320 = TMS320 DSPfamily

PACKAGE TYPE(A)

ZCE = 337-pin plastic BGA, with Pb-free soldered balls

DEVICE(B)

( )

SILICON REVISION

(

) (

)

TEMPERATURE RANGE (DEFAULT: 0°C TO 85°C)

0°C to 85°C, commercial temperature

A = 40°C to 10 °C

–

, extended temperature

Blank =

SPEED GRADE

216 or 21 = 216 MHz

270 = 270 MHz (with 216 MHz Max DDR)

135 or 13 = 135 MHz

27J = 270 MHz (with 198 MHz Max DDR)

(C)

A. BGA = Ball Grid Array

B. For actual device part numbers (P/Ns) and ordering information, contact your nearest TI Sales representative.

C. For more information on silicon revision, see

(literature number SPRZ264).

TMS320DM355 DMSoC Silicon Errata

TMS320DM355

SPRS463G – SEPTEMBER 2007 – REVISED JUNE 2010

www.ti.com

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the

package type (for example, ZCE), the temperature range (for example, "Blank" is the commercial

temperature range), and the device speed range in megahertz (for example, 202 is 202.5 MHz). The

following figure provides a legend for reading the complete device name for any TMS320DM355 DMSoC

platform member.

Figure 2-5. Device Nomenclature

2.21.3 Device Documentation

2.21.3.1 Related Documentation From Texas Instruments

The following documents describe the TMS320DM35x Digital Media System-on-Chip (DMSoC). Copies of

these documents are available on the internet at www.ti.com.

SPRS463

TMS320DM355 Digital Media System-on-Chip (DMSoC) Data Manual

This document

describes the overall TMS320DM355 system, including device architecture and features,

memory map, pin descriptions, timing characteristics and requirements, device mechanicals,

etc.

SPRZ264

TMS320DM355 DMSoC Silicon Errata Describes the known exceptions to the functional

specifications for the TMS320DM355 DMSoC.

SPRUFB3

TMS320DM35x Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference

Guide This document describes the ARM Subsystem in the TMS320DM35x Digital Media

System-on-Chip (DMSoC). The ARM subsystem is designed to give the ARM926EJ-S

(ARM9) master control of the device. In general, the ARM is responsible for configuration

and control of the device; including the components of the ARM Subsystem, the peripherals,

and the external memories.

SPRUED1

TMS320DM35x

Digital

Media

System-on-Chip

(DMSoC)

Asynchronous

External

Memory Interface (EMIF) Reference Guide This document describes the asynchronous

external memory interface (EMIF) in the TMS320DM35x Digital Media System-on-Chip

(DMSoC). The EMIF supports a glueless interface to a variety of external devices.

SPRUED2

TMS320DM35x Digital Media System-on-Chip (DMSoC) Universal Serial Bus (USB)

Controller Reference Guide This document describes the universal serial bus (USB)

controller in the TMS320DM35x Digital Media System-on-Chip (DMSoC). The USB controller

supports data throughput rates up to 480 Mbps. It provides a mechanism for data transfer

between USB devices and also supports host negotiation.

SPRUED3

TMS320DM35x Digital Media System-on-Chip (DMSoC) Audio Serial Port (ASP)

Device Overview

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Product Folder Link(s): TMS320DM355

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