CYT4DNJBJS datasheet(205/209 Pages) INFINEON

205 / 209 page

Datasheet

205

002-24601 Rev. *I

2023-02-14

TRAVEO™ T2G 32-bit Automotive MCU

Based on Arm® Cortex®-M7 dual

Revision history change log

26. Electrical specifi-

cations

Table 26-33

Sound subsystem specifications

TDM I/O settings

Table 26-31

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<4:0

> = 0b00011, CFG_IN_AU-

TOLVL/VTRIP_SEL<0:0>= 0b0,

CFG_IN/VTRIP_SEL<0:0> = 0b1,

CFG_SLEW_EXT/SLEW<0:0> =

0b0

Table 26-33

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<

2:0> = 0b011, CFG_IN_AU-

TOLVL/VTRIP_SEL<0:0>= 0b0,

CFG_IN/VTRIP_SEL<0:0> = 0b1,

CFG_SLEW_EXT/SLEW<0:0> = 0b0

Correction

26. Electrical specifi-

cations

Table 26-33

Sound subsystem specifications

TDM I/O settings

Table 26-31

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<4:0

> = 0b00100, CFG_IN_AU-

TOLVL/VTRIP_SEL<0:0>= 0b0,

CFG_IN/VTRIP_SEL<0:0> = 0b1,

CFG_SLEW_EXT/SLEW<0:0> =

0b0

Table 26-33

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<

2:0> = 0b100, CFG_IN_AU-

TOLVL/VTRIP_SEL<0:0>= 0b0,

CFG_IN/VTRIP_SEL<0:0> = 0b1,

CFG_SLEW_EXT/SLEW<0:0> = 0b0

Correction

26. Electrical specifi-

cations

Table 26-33

Sound subsystem specifications

(PCM) PWM

Table 26-31

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<4:0

> = 0b00011, CFG_SLEW_EXT/SLEW<0:0> =

0b0

Table 26-33

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<

2:0> = 0b011,

CFG_SLEW_EXT/SLEW<0:0> = 0b0

Correction

26. Electrical specifi-

cations

Table 26-33

Sound subsystem specifications

Sound Generator

Table 26-31

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<4:0

> = 0b00011, CFG_SLEW_EXT/SLEW<0:0> =

0b0

Table 26-33

HSIO_STDLN:

CFG_DRIVE_EXT<1:0>/DRIVE_SEL_EXT<

2:0> = 0b011,

CFG_SLEW_EXT/SLEW<0:0> = 0b0

Correction

26. Electrical specifi-

cations

Table 26-36

xSPI (JEDEC JESD251) Tap/DLL setting

requirement

Feature

Table 26-34

Delay Tap Setting for SMIF0

(Tx (MDL): CTL2:MDL_TAP_SEL

Rx (SDL): RX_CAPTURE_CONFIG:NEG_S-

DL_TAP_SEL / POS_SDL_TAP_SEL)

Table 26-36

Delay Tap Setting for SMIF0

(Tx (MDL):

SMIF_CORE_CTL2:MDL_TAP_SEL

Rx (SDL): SMIF_CORE_DEVICE_RX_CAP-

TURE_CONFIG:NEG_SDL_TAP_SEL /

POS_SDL_TAP_SEL)

Correction

26. Electrical specifi-

cations

Table 26-36

xSPI (JEDEC JESD251) Tap/DLL setting

requirement

Feature

Table 26-34

Delay Tap Setting for SMIF0

(Tx (MDL): CTL2:MDL_TAP_SEL

Rx (SDL): RX_CAPTURE_CONFIG:NEG_S-

DL_TAP_SEL / POS_SDL_TAP_SEL)

Table 26-36

Delay Tap Setting for SMIF1

(Tx (MDL):

SMIF_CORE_CTL2:MDL_TAP_SEL

Rx (SDL): SMIF_CORE_DEVICE_RX_CAP-

TURE_CONFIG:NEG_SDL_TAP_SEL /

POS_SDL_TAP_SEL)

Correction

26. Electrical specifi-

cations

Table 26-36

xSPI (JEDEC JESD251) Tap/DLL setting

requirement

Feature

Table 26-34

DLL Speed Mode (CTL2:DLL_SPEED_MODE)

Table 26-36

DLL Speed Mode

(SMIF_CORE_CTL2:DLL_SPEED_MODE)

Correction

26. Electrical specifi-

cations

Table 26-38

Table 26-36

Recommended I/O configuration:

HSIO_ENH/1.8V: CFG_OUT2/DS_TRIM<2:0

= 0b110, CFG_SLEW_EXT/SLEW<0:0> = 0b0

DLL Tap settings:

CTL2:MDL_TAP_SEL = 12,

Following DLL Tap settings have to be used

if DLP is not used:

RX_CAPTURE_CONFIG:NEG_SDL_TAP_SEL

/ POS_SDL_TAP_SEL = 8

All timingsaligned with respect to VT = (50%

× VDDIO_SMIF).

Table 26-38

Recommended configuration:

HSIO_ENH/1.8V I/O:

CFG_OUT2/DS_TRIM<2:0 = 0b110,

CFG_SLEW_EXT/SLEW<0:0> = 0b0

SMIF_CORE_CTL2:TX_SDR_EXTRA_-

SETUP = 1

DLL Tap settings for SMIF0/1:

SMIF_CORE_CTL2:MDL_TAP_SEL = 12

Following DLL Tap settings have to be

used if DLP is not used:

SMIF_CORE_DEVICE_RX_CAPTURE_-

CONFIG:NEG_SDL_TAP_SEL / POS_S-

DL_TAP_SEL = 8

All timings aligned with respect to VT =

(50% × VDDIO_SMIF).

Correction

26. Electrical specifi-

cations

26.15.1 VIDEOSS capture timing groups

Table 26-40

TTL_CAP0_CLK (SID875B/40 MHz) - P15.6

(ACT#9)

All lines of P9.0 to P9.7, P10.0 to P10.1, P11.0

to P11.6 and P12.0

(none)

Removed

28. Packaging

Table 28-2 Package characteristics

Parameter: RθJB

Description: Package θJB

Description: Package thermal resistance,

junction to board θJB

Correction

Rev. *I Section Updates (continued)

Section

Change Description

Current Spec (Rev. *H)

New Spec (Rev. *I)

Reason for change

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