MPC5744P datasheet(67/114 Pages) FREESCALE

67 / 114 page

Electrical characteristics

MPC5744P Data Sheet, Rev. 0.3

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

= thermocouple temperature on top of the package (°C)

= thermal characterization parameter (°C/W)

= power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T

thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so

that the thermocouple junction rests on the package. A small amount of epoxy is placed over the

thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire

is placed flat against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

3.4.1.1

References

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134 USA

(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at

800-854-7179 or 303-397-7956.

JEDEC specifications are available on the WEB at http://www.jedec.org.

1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.

2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled

Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.

3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance

and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.

212–220.

3.5

Electromagnetic Interference (EMI) characteristics

The Electromagnetic Interference (EMI) target characteristics are shown in Table 16:

•

Device configuration, test conditions, and EM testing per standard IEC61967-2

•

Supply voltage of 3.3 V DC

•

Ambient temperature of 25

°C

The configuration information referenced in Table 16 is explained in Table 15.

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