MPC5744P datasheet(64/114 Pages) FREESCALE

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MPC5744P Data Sheet, Rev. 0.3

Preliminary—Subject to Change Without Notice

Electrical characteristics

Freescale Semiconductor

3.4

Thermal characteristics

VDD_HV_ADRE0

VDD_HV_ADRE1

SR 3.3 V / 5.0 V ADC_0 high reference voltage

3.3 V / 5.0 V ADC_1 high reference voltage

—

3.0 to 5.5

VDD_HV_ADV

SR 3.3 V ADC supply voltage

—

3.15

3.6

VSS_HV_ADRE0

VSS_HV_ADRE1

SR ADC_0 ground and low reference voltage

ADC_1 ground and low reference voltage

—0

VSS_HV_ADV

SR 3.3 V ADC supply ground

—

VDD_LV_COR

SR Core supply, 1.25 V +/-5%

—

1.19

1.32

VDD_LV_CORx

SR Internal supply voltage

—

VSS_LV_CORx

SR Internal reference voltage

—

VDD_LV_PLL

SR Internal PLL supply voltage

—

1.19

1.32

VSS_LV_PLL

SR Internal PLL reference voltage

—

VDD_LV_NEXUS SR Aurora LVDS supply voltage

—

1.19

1.32

VSS_LV_NEXUS SR Aurora LVDS supply ground

—

VDD_LV_LFAST

SR LFAST supply voltage

—

1.19

1.32

VSS_LV_LFAST

SR LFAST supply ground

—

SR Ambient temperature under bias

fCPU ≤ TBD

–40

TBD

°C

SR Junction temperature under bias

—

–40

165

°C

NOTES:

1 Full functionality cannot be guaranteed when voltage drops below 3.0 V. In particular, ADC electrical characteristics

and I/Os DC electrical specification may not be guaranteed.

2 V

DD_HV_ADRE0 and VDD_HV_ADRE1 cannot be operated at different voltages, and need to be supplied by the same

voltage source.

3 Maximum frequency is TBD (design target: 180 MHz or greater).

Table 12. Thermal characteristics for 144 LQFP package1

NOTES:

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value Unit

RθJA

Thermal resistance, junction-to-ambient natural

convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package.

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJMA CC

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min

Single layer board – 1s

°C/W

Four layer board – 2s2p

RθJB

Thermal resistance junction-to-board3

—22

°C/W

RθJC

Thermal resistance junction-to-case4

—8

°C/W

ΨJT

Junction-to-package-top natural convection5

—3

°C/W

Table 11. Recommended operating conditions (VDD_HV_xx = 3.3 V) (continued)

Symbol

Parameter

Conditions

Min

Max1

Unit

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