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S32K310 bảng dữ liệu(PDF) 110 Page - NXP Semiconductors

tên linh kiện S32K310
Giải thích chi tiết về linh kiện  Supports S32K344, S32K324, S32K314, S32K312, S32K341 and S32K342. Data is preliminary for S32K311, S32K310, S32K328, S32K338, S32K348, S32K358 and S32K388
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S32K310 bảng dữ liệu(HTML) 110 Page - NXP Semiconductors

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TXC (at transmitter)
TXC (at receiver)
TX_CTL
TXD[8:5][3:0]
TXD[7:4][3:0]
TXD[8:5]
TXD[7:4]
TXD[3:0]
TXD[4]
TXEN
TXD[9]
TXERR
TskewT
TskewR
Figure 51. RGMII Transmit Timing
12.5.5 MDIO timing specifications
The following table describes the MDIO electrical characteristics. Measurements are with maximum output load of 25 pF, input
transition of 1 ns and pad configured with fastest slew settings (DSE = 1'b1 and SRE = 1’b0). I/O operating voltage ranges from
2.97 V to 3.63 V. MDIO pin must have external Pull-up.
Table 49. MDIO timing specifications
Symbol
Description
Min
Typ
Max
Unit
Condition
Spec
Number
—
MDC clock
frequency
—
—
2.5
MHz
—
—
MDC1
MDC pulse width
high
40
—
60
%MDC
period
—
MDC1
MDC2
MDC pulse width low 40
—
60
%MDC
period
—
MDC2
MDC5
MDC falling edge
to MDIO output
valid(maximum
propagation delay)
—
—
25
ns
—
MDC5
MDC6
MDC falling edge
to MDIO output
invalid(minimum
propagation delay)
-10
—
—
ns
—
MDC6
MDC3
MDIO (input) to
MDC rising edge
setup time
25
—
—
ns
—
MDC3
MDC4
MDIO (input) to
MDC rising edge
hold time
0
—
—
ns
—
MDC4
NXP Semiconductors
Communication interfaces
S32K3xx Data Sheet, Rev. 5.2, 10/2022
Data Sheet: Technical Data
Preliminary Information
110 / 137



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