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S32K310 bảng dữ liệu(PDF) 90 Page - NXP Semiconductors

tên linh kiện S32K310
Giải thích chi tiết về linh kiện  Supports S32K344, S32K324, S32K314, S32K312, S32K341 and S32K342. Data is preliminary for S32K311, S32K310, S32K328, S32K338, S32K348, S32K358 and S32K388
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S32K310 bảng dữ liệu(HTML) 90 Page - NXP Semiconductors

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background image
0
3.0
4.0
Vin level (V)
Junction Temp (°C)
VDD_HV_A (V)
HYSTCTR setting
0.5
2.5
4.5
5.0
1.0
3.5
5
25
1.5
2.0
00
01
10
11
20
40
60
Hysteresis
(mV)
0
Figure 35. Typical Hysteresis vs Vin level (VDD_HV_A = 5 V, Low Speed Mode).png
10.4 Temperature Sensor
The table below gives the specification for the on die temperature sensor.
Table 35. Temperature Sensor
Symbol
Description
Min
Typ
Max
Unit
Condition
Spec
Number
TS_TJ
Junction
temperature
monitoring range
-40
—
150
°C
—
—
TS_IV25
ON state current
consumption on V25
—
400
—
µA
ETS_EN=1
—
TS_ACC1
Temperature output
error at circuit output
(Voltage) 1, 2, 3
-5
0
+5
°C
100 °C < Tj <= 150 °C
—
TS_ACC2
Temperature output
error at circuit output
(Voltage) 1, 2, 3
-10
0
+10
°C
-40 °C <= Tj <=100 °C —
TS_TSTART
Circuit start up time
—
4
30
µs
—
—
TS_TADCSA
Required ADC
sampling time 1
1.2
—
—
µs
—
—
1. Required ADC sampling time specified by parameter TS_TADCSA needs to be used at the ADC conversion to guarantee
the specified accuracy. A smaller sampling time leads to a less accurate result.
2. Note: The temperature sensor measures the junction temperature Tj at the location where it is placed on die. The local Tj
is modulated by current and previous active state of the circuit elements on die.
3. The error caused by ADC conversion and provided temperature calculation formula is not included.
NXP Semiconductors
Analog modules
S32K3xx Data Sheet, Rev. 5.2, 10/2022
Data Sheet: Technical Data
Preliminary Information
90 / 137



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