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6402 bảng dữ liệu(PDF) 26 Page - Intel Corporation

tên linh kiện 6402
Giải thích chi tiết về linh kiện  Advanced Memory Buffer
PDF  250 Pages
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nhà sản xuất  INTEL [Intel Corporation]
Trang chủ  http://www.intel.com
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6402 bảng dữ liệu(HTML) 26 Page - Intel Corporation

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DDR Interface
26
Intel® 6400/6402 Advanced Memory Buffer Datasheet
3.3
Command / Address Outputs
Two sets of DRAM command and address output pins are provided for loading and
timing considerations. Each set drives the same DRAM commands, but the two address
busses are inverted from each other in order to reduce power consumption and heat
produced on the DIMM. The command and address output pin behavior is detailed
below:
1. Minimum address toggling. The address associated with the last command issued
on the DRAM bus is retained during DRAM NOP/Deselect commands. The address
and bank bits do not revert to all 1’s (or all 0’s) when the command bus is idle.
2. Balanced bank and address busses. With some exceptions, the bank and address
busses on the two bus copies are inverted from each other. This minimizes the
current load on the VTT supply regulator because the balanced address bus sinks as
much current as it sources. There are exceptions to the inversion behavior to allow
for commands that use one or more address bits to control DRAM functionality.
Balancing can also be disabled by setting the DRC.BALDIS register field.
Balancing Exceptions:
a. Address bit A10 is not balanced during all read, write, and precharge commands.
b. No address or bank bits are balanced during any MRS and EMRS commands.
c. Column address A0 is not balanced when the DRC.SEQADD bit is set. As with
A10, A0 is only not balanced during read, write, and precharge commands. This
mode is intended to work with DRAMs in sequential address mode.
d. No address or bank bits are balanced during any command when the
DRC.BALDIS register field is set.
3. Balanced idle command bus. When the command bus is idle, a deselect command
is issued with all chip selects high and all RAS/CAS/WE signals driven low on both
command/address copies.
4. Command/Address output control with CKE. All command and address pin outputs,
except for ODT, CKE, and CLK, will float one DRAM clock cycle after both CKE pins
transition from high to low. The command/address pins will be driven to valid signal
levels on the same cycle that either CKE pin is driven from low to high.
5. Output control during link reset. When the AMB core logic is in reset, CKE and ODT
will be driven low, and CLK will run at normal levels and frequency. The remaining
command/address pins will float during reset.
6. Command/Address output control in S3 mode. When the AMB core logic is in S3
power mode, all command/address outputs, including CKE, ODT, CLK, and all other
command/address pins, will be driven low.
7. CSR output control of command/address. All command/address pin outputs will
float when the appropriate DRC bits are set. Setting the DRC.CADIS field will float
the RAS, CAS, WE, Bank, and Address pins. DRC.CSDIS controls the chip select
pins. DRC.ODTDIS, DRC.CKEDIS, and DRC.CLKDIS float the ODT, CKE, and clock
pins respectively.



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