S32K310 datasheet(90/164 Pages) NXP

tên linh kiện	S32K310

Giải thích chi tiết về linh kiện	Supports S32K344, S32K324, S32K314, S32K312, S32K311, S32K310, S32K341, S32K342, S32K322, S32K328, S32K338, S32K348, S32K356, S32K358, S32K388 and S32K389. Data is preliminary for S32K312 and S32K344 100LQFP only.

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10.4 Temperature Sensor

The temperature sensor measures the junction temperature Tj at the location where it is placed on die. The local Tj is modulated

by current and previous active state of the circuit elements on die.

The table below gives the specification for the MCU on-die temperature sensor.

Table 41. Temperature Sensor

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

TS_TJ

Junction

temperature

monitoring range

-40

—

150

°C

—

TS_IV25

ON state current

consumption on V25

—

400

—

µA

ETS_EN=1

—

TS_ACC1

Temperature output

error at circuit output

(Voltage) [1][2]

-5

°C

100 °C < Tj <= 150 °C

—

TS_ACC2

Temperature output

error at circuit output

(Voltage) [1][2]

-10

+10

°C

-40 °C <= Tj <=100 °C —

TS_TSTART

Circuit start up time

—

µs

—

TS_TADCSA

Required ADC

sampling time [2]

1.2

—

µs

—

[1] The error caused by ADC conversion and provided temperature calculation formula is not included.

[2] Required ADC sampling time specified by parameter TS_TADCSA needs to be used at the ADC conversion to guarantee the specified accuracy. A

smaller sampling time leads to a less accurate result.

11 Clocking modules

11.1 FIRC

Table 42. FIRC

Symbol

Description

Min

Typ

Max

Unit

Condition

Spec

Number

fFIRC

FIRC nominal

Frequency

—

MHz

—

FACC

FIRC Frequency

deviation across

process, voltage,

and temperature

after trimming

-5

—

TSTART

Startup Time [1]

—

[1] Startup time is for reference only.

NXP Semiconductors

S32K3XX

S32K3xx Data Sheet

S32K3XX

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Product data sheet

Rev. 13 — 12 November 2025

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