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TMP411D bảng dữ liệu(PDF) 6 Page - Texas Instruments |
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TMP411D bảng dữ liệu(HTML) 6 Page - Texas Instruments |
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6 / 60 page ![]() 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Input voltage Pins 2, 3, 4 only TMP411-Q1 (Legacy chip) –0.5 (V+) + 0.5 V Pins 6, 7, 8 only –0.5 7 Pins 2, 3 only TMP411-Q1 (New chip) TMP411D-Q1 –0.5 2 V Pins 4, 6, 7, 8 only –0.5 6 Input current 10 mA Power supply, V+ TMP411-Q1 (Legacy chip) 7 V TMP411-Q1 (New chip) TMP411D-Q1 6 Operating temperature range –55 127 °C Junction temperature, TJ(max) 150 °C Storage temperature, Tstg –60 130 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) HBM ESD Classification Level 2 TMP411-Q1 (Legacy chip) ±2000 V TMP411-Q1 (New chip) TMP411D-Q1 ±3000 Charged device model (CDM), per AEC Q100-011 CDM ESD Classification Level C4B TMP411-Q1 (Legacy chip) ±750 TMP411-Q1 (New chip) TMP411D-Q1 ±1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions Over free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT V+ Supply voltage, TMP411-Q1 2.7 3.3 5.5 V Supply voltage, TMP411D-Q1 1.62 3.3 5.5 TA Operating free-air temperature –40 125 °C 6.4 Thermal Information THERMAL METRIC(1) TMP411-Q1 TMP411D-Q1 UNIT DGK (VSSOP) Legacy chip DGK (VSSOP) New chip DDF (SOT-23) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 150 161.5 182.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance N/A 71.1 98.9 °C/W RθJB Junction-to-board thermal resistance N/A 96.6 99.1 °C/W ψJT Junction-to-top characterization parameter N/A 9.2 10.4 °C/W TMP411-Q1, TMP411D-Q1 SBOS527G – DECEMBER 2010 – REVISED SEPTEMBER 2025 www.ti.com 6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: TMP411-Q1 TMP411D-Q1 |
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