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HCS08 bảng dữ liệu(PDF) 186 Page - NXP Semiconductors |
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HCS08 bảng dữ liệu(HTML) 186 Page - NXP Semiconductors |
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186 / 198 page ![]() Appendix A Electrical Characteristics MC9S08QD4 Series MCU Data Sheet, Rev. 6 186 Freescale Semiconductor A.8 AC Characteristics This section describes AC timing characteristics for each peripheral system. A.8.1 Control Timing Figure A-12. Reset Timing Table A-8. Control Timing Parameter Symbol Min Typical1 1 Data in Typical column was characterized at 3.0 V, 25 °C. Max Unit Bus frequency (tcyc = 1/fBus)fBus 1—8 MHz Real-time interrupt internal oscillator period tRTI 700 — 1300 μs External reset pulse width2 2 This is the shortest pulse that is guaranteed to be recognized. textrst 100 — — ns IRQ pulse width Asynchronous path2 Synchronous path3 3 This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case. tILIH, tIHIL 100 1.5 tcyc —— ns KBIPx pulse width Asynchronous path2 Synchronous path3 tILIH, tIHIL 100 1.5 tcyc —— ns Port rise and fall time (load = 50 pF)4 Slew rate control disabled (PTxSE = 0) Slew rate control enabled (PTxSE = 1) 4 Timing is shown with respect to 20% V DD and 80% VDD levels. Temperature range –40°C to 125°C. tRise, tFall — — 3 30 — — ns BKGD/MS setup time after issuing background debug force reset to enter user or BDM modes tMSSU 500 — — ns BKGD/MS hold time after issuing background debug force reset to enter user or BDM modes 5 5 To enter BDM mode following a POR, BKGD/MS must be held low during the power-up and for a hold time of t MSH after VDD rises above VLVD. tMSH 100 — — μs textrst RESET PIN |
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