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MCIMX503CVM8B bảng dữ liệu(PDF) 39 Page - NXP Semiconductors

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Electrical Characteristics
i.MX50 Applications Processors for Consumer Products, Rev. 7
Freescale Semiconductor
39
4.4.3
HVIO Output Buffer Impedance
Table 26 shows the HVIO output buffer impedance of the i.MX50 processor.
NOTE
Output driver impedance is measured with long transmission line of
impedance Ztl attached to I/O pad and incident wave launched into
transmission line. Rpu/Rpd and Ztl form a voltage divider that defines
specific voltage of incident wave relative to OVDD. Output driver
impedance is calculated from this voltage divider (see Figure 3).
Table 26. HVIO Output Buffer Impedance
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
OVDD
1.95 V
OVDD
3.3 V
OVDD
1.875 V
OVDD
3.30V
OVDD
1.65 V
OVDD
2.68 V
Output driver
impedance
Rpu
Low drive strength, Ztl = 150
Ω
Medium drive strength, Ztl = 75
Ω
High drive strength, Ztl = 50
Ω
113.5
56.2
37.8
103.8
51.9
35.1
130.6
66
45.9
133
69.2
41
219.4
109.7
73.1
212.2
111.1
71.8
Ω
Output driver
impedance
Rpd
Low drive strength, Ztl =1 50
Ω
Medium drive strength, Ztl = 75
Ω
High drive strength, Ztl = 50
Ω
78.5
39.7
26.8
70
34.5
23
113.6
56.8
38.3
102
50
33.3
230.8
115.4
76.9
179.5
89.8
60.7
Ω



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