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845GL bảng dữ liệu(PDF) 155 Page - Intel Corporation |
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845GL bảng dữ liệu(HTML) 155 Page - Intel Corporation |
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155 / 193 page ![]() Intel® 82845G/82845GL/82845GV GMCH Datasheet 155 Ballout and Package Information Ballout and Package Information 7 This chapter provides the ballout listing and the package dimensions for the 82845G GMCH. 7.1 Intel® 82845G GMCH Ballout Figure 7-1 and Figure 7-2 show the 82845G GMCH footprint with the ball names listed for each ball. Table 7-1 lists the ballout organized by ball number. Table 7-2 lists the ballout organized alphabetically by signal name. The following notes apply to the ballout: Note: For the multiplexed DDR and SDR interface signals, only the DDR signal names are listed in this chapter. Refer to Section 2.2.2 for the SDR-to-DDR signal mapping. Note: For the multiplexed AGP and DVO signals, only the AGP signal names are listed in this chapter. Refer to Section 2.5.1 for the DVO-to-AGP signal mapping. Note: NC = No Connect. Note: RSVD = These pins should not be connected and should be allowed to float. |
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