PC87591L datasheet(382/437 Pages) NSC

382 / 437 page

7.0 Device Specifications (Continued)

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382

Revision 1.07

7.6

AC ELECTRICAL CHARACTERISTICS

7.6.1

AC Test Conditions

Figure 124. AC Test Conditions, TA =0°Cto70°C, VSUP = 3.3V ±10%

Notes:

1. VSUP is VDD, VCC, AVCC or VBAT, according to the power well of the pin.

2. CL = 50 pF for all output pins (this value includes both jig and oscilloscope capacitance).

3. S1 = Open for push-pull output pins.

S1 = VSUP for high impedance to active low and active low to high impedance measurements.

S1 = VSS for high impedance to active high and active high to high impedance measurements.

RL = 1.0 KΩ

The following abbreviations are used in Section 7.6:

RE = Rising Edge

FE = Falling Edge

Deﬁnitions

The timing specifications in this section refer to low- or high-level voltage, according to the specific buffer type (TTL or

CMOS) on the rising or falling edges of all the signals, as illustrated in the following figures, unless specifically stated other-

wise.

Figure 125. CMOS Output Signals Speciﬁcation Conventions

Device

Under

Test

0.1

µf

Input

Output

Load Circuit (Notes 1, 2, 3)

AC Testing Input, Output Waveform

VSUP

2.4

0.4

2.0

0.8

Test Points

2.0

0.8

CLK

SIG1

SIG2

VOH, VOHhd

VOL, VOLhd

VOH, VOHhd

VOL, VOLhd

tSIG1v tSIG1a

Vcc * 0.3

Vcc * 0.7

2.0V

2.40V

Vcc * 0.7

Vcc * 0.3

tSIG2h

tSIG1h

tSIG2v tSIG2a

or tSIG1ia

or tSIG2ia

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