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STM32F101X8 bảng dữ liệu(PDF) 81 Page - STMicroelectronics

tên linh kiện STM32F101X8
Giải thích chi tiết về linh kiện  Medium-density access line, ARM-based 32-bit MCU with 64 or 128 KB Flash, 6 timers, ADC and 7 communication interfaces
PDF  85 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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STM32F101X8 bảng dữ liệu(HTML) 81 Page - STMicroelectronics

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STM32F101x8, STM32F101xB
Revision history
Doc ID 13586 Rev 13
81/85
22-Nov-2007
4
Document status promoted from preliminary data to datasheet. Small
text changes.
STM32F101CB part number corrected in Table 1: Device summary.
Number of communication peripherals corrected for STM32F101Tx in
Table 2: Device features and peripheral counts (STM32F101xx medium-
density access line) and Number of GPIOs corrected for LQFP package.
Power supply schemes on page 16 modified.
Main function and default alternate function modified for PC14 and PC15
in Table 4: Medium-density STM32F101xx pin definitions, Note 6 added,
Remap column added.
Figure 11: Power supply scheme modified. VDD VSS ratings modified
and Note 1 modified in Table 5: Voltage characteristics. Note 1 modified
in Table 6: Current characteristics.
Note 2 added in Table 10: Embedded reset and power control block
characteristics.
48 and 72 MHz frequencies removed from Table 12, Table 13 and
Table 14. MCU ‘s operating conditions modified in Typical current
consumption on page 41.
IDD_VBAT typical value at 2.4 V modified and IDD_VBAT maximum value
added in Table 15: Typical and maximum current consumptions in Stop
and Standby modes. Note added in Table 16 on page 41 and Table 17
on page 42. Table 18: Peripheral current consumption modified.
Figure 17: Typical current consumption in Stop mode with regulator in
Low-power mode versus temperature at VDD = 3.3 V and 3.6 V added.
Note removed below Figure 30: SPI timing diagram - slave mode and
CPHA = 0. Note added below Figure 31: SPI timing diagram - slave
mode and CPHA = 1(1).
Figure 34: Typical connection diagram using the ADC modified.
tSU(HSE) and tSU(LSE) conditions modified in Table 21 and Table 22,
respectively. Maximum values removed from Table 25: Low-power mode
wakeup timings. tRET conditions modified in Table 28: Flash memory
endurance and data retention. Conditions modified in Table 29: EMS
characteristics.
Impedance size specified in A.4: Voltage glitch on ADC input 0 on
page 71. Small text changes in Table 34: Output voltage characteristics.
Section 5.3.11: Absolute maximum ratings (electrical sensitivity)
updated.
Details on unused pins removed from General input/output
characteristics on page 52.
Table 40: SPI characteristics updated. Notes added and Ilkg removed in
Table 41: ADC characteristics. Note added in Table 42 and Table 45.
Note 3 and Note 2 added below Table 43: ADC accuracy - limited test
conditions. Avg_Slope and V25 modified in Table 45: TS characteristics.
JAvalue for VFQFPN36 package added in Table 51: Package thermal
characteristics
I2C interface characteristics on page 59 modified.
Order codes replaced by Section 7: Ordering information scheme.
Table 53.
Document revision history (continued)
Date
Revision
Changes



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