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ADIN3310BBCZ bảng dữ liệu(PDF) 12 Page - Analog Devices

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ADIN3310BBCZ bảng dữ liệu(HTML) 12 Page - Analog Devices

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Data Sheet
ADIN3310/ADIN6310
SPECIFICATIONS
analog.com
Rev. A | 12 of 86
Table 1. Electrical Characteristics1 (Continued)
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
Crystal Oscillator RMS Jitter
1.8
ps
Clock Input Frequency (CLK_IN)
25
MHz
Requirements for external clock applied to XTAL_IN pin;
VDD3P3 voltage domain
Duty Cycle
40
60
%
Input Voltage Range
3.135
3.3
3.465
V
FLASH MEMORY
Endurance
10,000
Cycles
Data Retention
10
Years
TJ = 125°C
20
Years
TJ = 85°C
1 Specifications may be subject to change.
2 When all six ports operate at 1 Gbps, use a VDDIO_B supply voltage of 1.8 V or 2.5 V to minimize power consumption.
3 Enabling SendList on the ADIN3310 adds 15 mA to the VDDCORE current consumption.
4 Guaranteed by design.
5 minByteCnt represents the number of received bytes before a cut-through frame is queued for transmission. The purpose is to remove the latency jitter due to access time
in the lookup table. The default setting for minByteCnt = 0x20. For this specification, minByteCnt was reduced to 0x10 so that when the VLAN is received and the lookup
table provides the routing information, the frame is immediately queued for transmission. Using lower numbers can decrease latency and increase jitter.
6 Latency from the SGMII to SGMII port = SGMII Receive + Bridge Latency + SGMII Transmit. Latency from the SGMII to RGMII port = SGMII Receive + Bridge Latency.
Latency from the RGMII to SGMII port = Bridge Latency + SGMII Transmit.
7 Where load capacitance (CL) = ((C1 × C2)/(C1 + C2) + CSTRAY), where CSTRAY is the stray capacitance including routing and package parasitics.



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