CYT4DNJBJS datasheet(189/209 Pages) INFINEON

189 / 209 page

Datasheet

189

002-24601 Rev. *I

2023-02-14

TRAVEO™ T2G 32-bit Automotive MCU

Based on Arm® Cortex®-M7 dual

Packaging

CYT4DN microcontroller is offered in the packages listed in the Table 28-1.

Table 28-1

Package information

Package

Dimensions[97]

Contact/Lead Pitch Coefficient of Thermal Expansion I/O Pins

327-BGA

17 × 17 × 1.70 mm (max)

0.8-mm

a1[98] = 6 ppm/°C, a2[99] = 25 ppm/°C

168

Table 28-2

Package characteristics[100]

Parameter

Description

Conditions

Min

Typ

Max

Units

Operating ambient temperature

A-grade

–40

–

°C

Operating ambient temperature

S-grade

–40

–

105

°C

Operating junction temperature

–

150

°C

RθJA

Package thermal resistance,

junction to ambient θJA[101]

327-BGA

–

14.8

°C/Watt

RθJB

Package thermal resistance,

junction to board θJB

327-BGA

–

9.9

°C/Watt

RθJC

Package thermal resistance,

junction to case θJC

327-BGA

–

2.1

°C/Watt

Table 28-3

Solder reflow peak temperature, Package moisture sensitivity level (MSL), IPC/JEDEC

J-STD-2

Package

Maximum peak temperature

(°C)

Maximum time at peak temperature

(seconds)

MSL

327-BGA

260

Notes

97.The dimensions (column 2) are valid for room temperature.

98.a1 = CTE (Coefficient of Thermal Expansion) value below Tg (ppm/°C) (Tg is glass transition temperature which is 131°C).

99.a2 = CTE value above Tg (ppm/°C).

100.Board condition complies to JESD51-7(4 Layers).

101.The TA and TJ values for the packages will be provided in a later revision of the datasheet.

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