PCIMX515CJM6C datasheet(1/184 Pages) FREESCALE

tên linh kiện	PCIMX515CJM6C

Giải thích chi tiết về linh kiện	i.MX51 Applications Processors for Consumer and Industrial Products

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nhà sản xuất	FREESCALE [Freescale Semiconductor, Inc]

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Preliminary—Subject to Change Without Notice

Freescale Semiconductor

Data Sheet: Advance Information

Document Number: IMX51CEC

Rev. 1, 11/2009

IMX51

Package Information

Plastic Package

Case 2058 13 x 13 mm, 0.5 mm pitch

Case 2017 19 x 19 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 3 for ordering information.

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

1

Introduction

The i.MX51 multimedia applications processors

represent Freescale Semiconductor’s latest addition to a

growing family of multimedia-focused products offering

high performance processing optimized for lowest

power consumption.

The i.MX51 processors feature Freescale’s advanced

and power-efficient implementation of the ARM Cortex

A8™ core, which operates at speeds as high as

800 MHz. Up to 200 MHz DDR2 and mobile DDR

DRAM clock rates are supported. These devices are

suitable for applications such as the following:

•

Netbooks (web tablets)

•

Nettops (internet desktop devices)

•

Mobile internet devices (MID)

•

Portable media players (PMP)

•

Portable navigation devices (PND)

•

High-end PDAs

•

Gaming consoles

•

Automotive navigation and entertainment (see

automotive data sheet, IMX51AEC)

i.MX51 Applications

Processors for Consumer and

Industrial Products

1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1

Special Signal Considerations. . . . . . . . . . . . . . . . 12

3

Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 14

3.1

Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 14

3.2

Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.3

I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 21

3.4

Output Buffer Impedance Characteristics . . . . . . . 28

3.5

I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31

3.6

Module Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3.7

External Peripheral Interfaces . . . . . . . . . . . . . . . . 60

4

Package Information and Contact Assignments . . . . . . 137

4.1

13

× 13 mm Package Information . . . . . . . . . . . . 137

4.2

19

× 19 mm Package Information . . . . . . . . . . . . 156

4.3

13

× 13 mm, 0.5 Pitch Ball Map . . . . . . . . . . . . . 174

4.4

19 x 19 mm, 0.8 Pitch Ball Map. . . . . . . . . . . . . . 179

5

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

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