STM32F103X6_08 datasheet(31/84 Pages) STMICROELECTRONICS

tên linh kiện	STM32F103X6

Giải thích chi tiết về linh kiện	Performance line, ARM-based 32-bit MCU with Flash, USB, CAN, seven 16-bit timers, two ADCs and nine communication interfaces

PDF	84 Pages

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nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

Trang chủ	http://www.st.com

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STM32F103xx

Electrical characteristics

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5.3

Operating conditions

5.3.1

General operating conditions

5.3.2

Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 8.

Operating conditions at power-up / power-down

Table 6.

Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

–65 to +150

°C

Maximum junction temperature

150

°C

Table 7.

General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK1

Internal APB1 clock frequency

fPCLK2

Internal APB2 clock frequency

VDD

Standard operating voltage

3.6

VBAT

Backup operating voltage

1.8

3.6

Power dissipation at TA = 85 °C

for suffix 6 or TA = 105 °C for

suffix 7(1)

If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal

characteristics on page 76).

LFBGA100

487

LQFP100

434

LQFP64

444

LQFP48

363

VFQFPN36

1110

Ambient temperature for 6

suffix version

Maximum power dissipation

–40

°C

Low power dissipation(2)

In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Table 6.2: Thermal characteristics on page 76).

–40

105

Ambient temperature for 7

suffix version

Maximum power dissipation

–40

105

°C

Low power dissipation(2)

–40

125

Junction temperature range

6 suffix version

–40

105

°C

7 suffix version

–40

125

Symbol

Parameter

Conditions

Min

Max

Unit

tVDD

VDD rise time rate

∞

µs/V

VDD fall time rate

∞

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