STM32F103X6_08 datasheet(70/84 Pages) STMICROELECTRONICS

tên linh kiện	STM32F103X6

Giải thích chi tiết về linh kiện	Performance line, ARM-based 32-bit MCU with Flash, USB, CAN, seven 16-bit timers, two ADCs and nine communication interfaces

PDF	84 Pages

Scroll/Zoom	100%

nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

Trang chủ	http://www.st.com

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70 / 84 page

Package characteristics

STM32F103xx

70/84

Drawing is not to scale.

The back-side pad is not internally connected to the VSS or VDD power pads.

There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should

also be soldered to the PCB.

Figure 33.

VFQFPN36 6 x 6 mm, 0.5 mm pitch,

package outline(1)

Figure 34.

Recommended footprint

(dimensions in mm)(1)(2)(3)

Seating plane

ddd

Pin # 1 ID

R = 0.20

ZR_ME

0.75

0.30

6.30

0.50

1.00

4.30

4.80

4.10

4.30

ai14870

Table 49.

VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.800

0.900

1.000

0.0315

0.0354

0.0394

0.020

0.050

0.0008

0.0020

0.650

1.000

0.0256

0.0394

0.250

0.0098

0.180

0.230

0.300

0.0071

0.0091

0.0118

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

0.450

0.500

0.550

0.0177

0.0197

0.0217

0.350

0.550

0.750

0.0138

0.0217

0.0295

ddd

0.080

0.0031

Values in inches are converted from mm and rounded to 4 decimal digits.

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