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STM32F103X6 bảng dữ liệu(PDF) 83 Page - STMicroelectronics |
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STM32F103X6 bảng dữ liệu(HTML) 83 Page - STMicroelectronics |
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83 / 84 page ![]() STM32F103xx Revision history 83/84 14-Mar-2008 5 Figure 2: Clock tree on page 16 added. Maximum TJ value given in Table 6: Thermal characteristics on page 31. CRC feature added (see CRC (cyclic redundancy check) calculation unit on page 9 and Figure 8: Memory map on page 26 for address). IDD modified in Table 14: Typical and maximum current consumptions in Stop and Standby modes. ACCHSI modified in Table 23: HSI oscillator characteristics on page 48, note 2 removed. PD, TA and TJ added, tprog values modified and tprog description clarified in Table 27: Flash memory characteristics on page 50. tRET modified in Table 28: Flash memory endurance and data retention. VNF(NRST) unit corrected in Table 36: NRST pin characteristics on page 56. Table 40: SPI characteristics on page 60 modified. IVREF added to Table 44: ADC characteristics on page 64. Table 46: ADC accuracy - limited test conditions added. Table 47: ADC accuracy modified. LQFP100 package specifications updated (see Section 6: Package characteristics on page 69). Recommended LQFP100, LQFP 64, LQFP48 and VFQFPN36 footprints added (see Figure 38, Figure 40, Figure 42 and Figure 34). Section 6.2: Thermal characteristics on page 76 modified, Section 6.2.1 and Section 6.2.2 added. Appendix A: Important notes on page 81 removed. 21-Mar-2008 6 Small text changes. Figure 8: Memory map clarified. In Table 28: Flash memory endurance and data retention: –NEND tested over the whole temperature range – cycling conditions specified for tRET –tRET min modified at TA = 55 °C V25, Avg_Slope and TL modified in Table 48: TS characteristics. CRC feature removed. Table 56. Document revision history (continued) Date Revision Changes |
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