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STM32F103X6 bảng dữ liệu(PDF) 76 Page - STMicroelectronics

tên linh kiện STM32F103X6
Giải thích chi tiết về linh kiện  Performance line, ARM-based 32-bit MCU with Flash, USB, CAN, seven 16-bit timers, two ADCs and nine communication interfaces
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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STM32F103X6 bảng dữ liệu(HTML) 76 Page - STMicroelectronics

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Package characteristics
STM32F103xx
76/84
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 7: General operating conditions on page 31.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
●
TA max is the maximum ambient temperature in ° C,
●
ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
●
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
●
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Table 54.
Thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LFBGA100 - 10 x 10 mm / 0.5 mm pitch
41
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
46
Thermal Resistance Junction-Ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
45
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
55
Thermal resistance junction-ambient
VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch
18



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