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UPD77533 bảng dữ liệu(PDF) 85 Page - Renesas Technology Corp

tên linh kiện UPD77533
Giải thích chi tiết về linh kiện  MOS INTEGRATED CIRCUIT
PDF  104 Pages
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nhà sản xuất  RENESAS [Renesas Technology Corp]
Trang chủ  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

UPD77533 bảng dữ liệu(HTML) 85 Page - Renesas Technology Corp

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Data Sheet S15671EJ4V0DS
83
µµµµPD77533
22. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales
representative.
µµµµPD77533S1-YHC: 108-pin plastic BGA (fine pitch) (11 ×××× 11)
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared reflow
Package peak temperature: 260
°C, Time: 60 seconds max. (at
220
°C or higher), Count: Twice or less, Exposure limit: 3 daysNote
(after that, prebake at 125
°C for 10 to 72 hours)
IR30-103-2
Note After opening the dry pack, store it at 25
°C or less and 65% RH or less for the allowable storage period.



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