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Electrical characteristics
i.MX 8M Plus Applications Processor Datasheet for Consumer Products, Rev. 0, 03/2021
NXP Semiconductors
77
Figure 45. FlexSPI output timing in SDR mode
3.8.12.2.2 DDR mode
TDSO
[D:] Output data setup time
2
—
ns
TDHO
[D:] Output data hold time
2
—
ns
TCSS
[D:] Chip select output setup time
3 x TCK - 1
—
ns
TCSH
[D:] Chip select output hold time
3 x TCK - 1
—
ns
1 The actual maximum frequency supported is limited by the FlexSPIn_MCR0[RXCLKSRC] configuration used. See the
FlexSPI SDR input timing specifications.
NOTE
TCSS and TCSH are configured by the FlexSPIn_FLSHAxCR1 register, the
default values are shown above. See the i.MX 8M Plus Applications
Processor Reference Manual (IMX8MPRM) for more details.
Table 64. FlexSPI output timing in DDR mode
Symbol
Parameter
Min.
Max.
Unit
—
[D:] Frequency of operation1
1 The actual maximum frequency supported is limited by the FlexSPIn_MCR0[RXCLKSRC] configuration used. See the
FlexSPI SDR input timing specifications.
NOTE
TCSS and TCSH are configured by the FlexSPIn_FLSHAxCR1 register, the
default values are shown above. See the i.MX 8M Plus Applications
Processor Reference Manual (IMX8MPRM) for more details.
—166
MHz
TCK
[D:] SCK clock period
6.02
—
ns
TDSO
[D:] Output data setup time
—
0.6
ns
TDHO
[D:] Output data hold time
0.6
—
ns
TCSS
[D:] Chip select output setup time
3 x TCK - 1.075
—
ns
TCSH
[D:] Chip select output hold time
3 x TCK - 1.075
—
ns
Table 63. FlexSPI output timing in SDR mode (continued)
Symbol
Parameter
Min.
Max.
Unit
TCSS
TCK
TCSH
TDVO
TDHO
TDVO
TDHO
SCK
CS
SIO[0:7]



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