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IMX8MPCEC bảng dữ liệu(HTML) 77 Page - NXP Semiconductors |
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77 / 111 page ![]() Electrical characteristics i.MX 8M Plus Applications Processor Datasheet for Consumer Products, Rev. 0, 03/2021 NXP Semiconductors 77 Figure 45. FlexSPI output timing in SDR mode 3.8.12.2.2 DDR mode TDSO [D:] Output data setup time 2 — ns TDHO [D:] Output data hold time 2 — ns TCSS [D:] Chip select output setup time 3 x TCK - 1 — ns TCSH [D:] Chip select output hold time 3 x TCK - 1 — ns 1 The actual maximum frequency supported is limited by the FlexSPIn_MCR0[RXCLKSRC] configuration used. See the FlexSPI SDR input timing specifications. NOTE TCSS and TCSH are configured by the FlexSPIn_FLSHAxCR1 register, the default values are shown above. See the i.MX 8M Plus Applications Processor Reference Manual (IMX8MPRM) for more details. Table 64. FlexSPI output timing in DDR mode Symbol Parameter Min. Max. Unit — [D:] Frequency of operation1 1 The actual maximum frequency supported is limited by the FlexSPIn_MCR0[RXCLKSRC] configuration used. See the FlexSPI SDR input timing specifications. NOTE TCSS and TCSH are configured by the FlexSPIn_FLSHAxCR1 register, the default values are shown above. See the i.MX 8M Plus Applications Processor Reference Manual (IMX8MPRM) for more details. —166 MHz TCK [D:] SCK clock period 6.02 — ns TDSO [D:] Output data setup time — 0.6 ns TDHO [D:] Output data hold time 0.6 — ns TCSS [D:] Chip select output setup time 3 x TCK - 1.075 — ns TCSH [D:] Chip select output hold time 3 x TCK - 1.075 — ns Table 63. FlexSPI output timing in SDR mode (continued) Symbol Parameter Min. Max. Unit TCSS TCK TCSH TDVO TDHO TDVO TDHO SCK CS SIO[0:7] |
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