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IMX8MPCEC bảng dữ liệu(PDF) 49 Page - NXP Semiconductors

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Electrical characteristics
i.MX 8M Plus Applications Processor Datasheet for Consumer Products, Rev. 0, 03/2021
NXP Semiconductors
49
3.8.2.2
eMMC5.1/SD3.0 (dual data rate) AC timing
Figure 16 depicts the timing of eMMC5.1/SD3.0 (DDR). Table 40 lists the eMMC5.1/SD3.0 (DDR)
timing characteristics. Be aware that only DATA is sampled on both edges of the clock (not applicable to
CMD).
Figure 16. eMMC5.1/SD3.0 (DDR) timing
SD4
Clock Rise Time
tTLH
—3
ns
SD5
Clock Fall Time
tTHL
—3
ns
uSDHC Output/Card Inputs SD_CMD, SDx_DATAx (Reference to CLK)
SD6
uSDHC Output Delay
tOD
6.6
3.6
ns
uSDHC Input/Card Outputs SD_CMD, SDx_DATAx (Reference to CLK)
SD7
uSDHC Input Setup Time
tISU
2.5
ns
SD8
uSDHC Input Hold Time4
tIH
1.5
ns
1 In Low-Speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.
2 In Normal (Full) -Speed mode for SD/SDIO card, clock frequency can be any value between 0 – 25 MHz. In High-speed mode,
clock frequency can be any value between 0
– 50 MHz.
3 In Normal (Full) -Speed mode for MMC card, clock frequency can be any value between 0 – 20 MHz. In High-speed mode,
clock frequency can be any value between 0
– 52 MHz.
4 To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.
Table 40. eMMC5.1/SD3.0 (DDR) interface timing specification
ID
Parameter
Symbols
Min
Max
Unit
Card Input Clock
SD1
Clock Frequency (eMMC5.1 DDR)
fPP
052
MHz
SD1
Clock Frequency (SD3.0 DDR)
fPP
050
MHz
Table 39. SD3.0/eMMC5.1 (SDR) interface timing specification (continued)
ID
Parameter
Symbols
Min
Max
Unit
SD1
SD2
SD3
Output from eSDHCv3 to card
Input from card to eSDHCv3
SDx_DATA[7:0]
SDx_CLK
SD4
SD2
......
......
SDx_DATA[7:0]



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