This configuration lays out alternating signal traces on different layers; thus, the horizontal separation between

traces can be less than 2 or 3 times the width of individual traces. To ensure continuity in the ground signal path,

TI recommends having an adjacent ground via for every signal via, as shown in Figure 10-8. Note that vias

create additional capacitance. For example, a typical via has a lumped capacitance effect of 1/2 pF to 1 pF in

FR4.

Signal Trace

Uninterrupted Ground Plane

Signal Trace

Uninterrupted Ground Plane

Signal Via

Ground Via

Figure 10-8. Ground Via Location (Side View)

Short and low-impedance connection of the device ground pins to the PCB ground plane reduces ground

bounce. Holes and cutouts in the ground planes can adversely affect current return paths if they create

discontinuities that increase returning current loop areas.

To minimize EMI problems, TI recommends avoiding discontinuities below a trace (for example, holes, slits, and

so on) and keeping traces as short as possible. Zoning the board wisely by placing all similar functions in the

same area, as opposed to mixing them together, helps reduce susceptibility issues.

www.ti.com

SN65MLVD203B

SLLSFG7 – AUGUST 2020

Copyright © 2020 Texas Instruments Incorporated

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