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SPC564A80L7 bảng dữ liệu(PDF) 101 Page - STMicroelectronics

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SPC564A74L7, SPC564A80B4, SPC564A80L7
Electrical characteristics
Doc ID 15399 Rev 9
101/157
3.9
I/O pad current specifications
The power consumption of an I/O segment depends on the usage of the pins on a particular
segment. The power consumption is the sum of all output pin currents for a particular
segment. The output pin current can be calculated from Table 22 based on the voltage,
frequency, and load on the pin. Use linear scaling to calculate pin currents for voltage,
frequency, and load parameters that fall outside the values given in Table 22.
Table 22.
I/O pad average IDDE specifications
(1)
Pad Type
Symbol
C
Period
(ns)
Load(2)
(pF)
VDDE
(V)
Drive/Slew
Rate Select
IDDE Avg
(mA)(3)
IDDE RMS
(mA)
Slow
IDRV_SSR_HV
CC
D
37
50
5.5
11
9
—
CC
D
130
50
5.5
01
2.5
—
CC
D
650
50
5.5
00
0.5
—
CC
D
840
200
5.5
00
1.5
—
Medium
IDRV_MSR_HV
CC
D
24
50
5.5
11
14
—
CC
D
62
50
5.5
01
5.3
—
CC
D
317
50
5.5
00
1.1
—
CC
D
425
200
5.5
00
3
—
Fast
IDRV_FC
CC
D
10
50
3.6
11
22.7
68.3
CC
D
10
30
3.6
10
12.1
41.1
CC
D
10
20
3.6
01
8.3
27.7
CC
D
10
10
3.6
00
4.44
14.3
CC
D
10
50
1.98
11
12.5
31
CC
D
10
30
1.98
10
7.3
18.6
CC
D
10
20
1.98
01
5.42
12.6
CC
D
10
10
1.98
00
2.84
6.4
MultiV
(High
Swing
Mode)
IDRV_MULTV_HV
CC
D
20
50
5.5
11
9
—
CC
D
30
50
5.5
01
6.1
—
CC
D
117
50
5.5
00
2.3
—
CC
D
212
200
5.5
00
5.8
—
MultiV
(Low
Swing
Mode)
IDRV_MULTV_HV
CC
D
30
30
5.5
11
3.4
—
1.
Numbers from simulations at best case process, 150 °C.
2.
All loads are lumped.
3.
Average current is for pad configured as output only.



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