SPC564A80L7 datasheet(87/157 Pages) STMICROELECTRONICS

87 / 157 page

SPC564A74L7, SPC564A80B4, SPC564A80L7

Electrical characteristics

Doc ID 15399 Rev 9

87/157

board. This model can be used to generate simple estimations and for computational fluid

dynamics (CFD) thermal models.

To determine the junction temperature of the device in the application on a prototype board,

use the thermal characterization parameter (



JT) to determine the junction temperature by

measuring the temperature at the top center of the package case using the following

equation:

Equation 4 TJ = TT + (JT x PD)

where:

TT = thermocouple temperature on top of the package (

oC)



JT = thermal characterization parameter (

oC/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured in compliance with the JESD51-2

specification using a 40-gauge type T thermocouple epoxied to the top center of the

package case. Position the thermocouple so that the thermocouple junction rests on the

package. Place a small amount of epoxy on the thermocouple junction and approximately 1

mm of wire extending from the junction. Place the thermocouple wire flat against the

package case to avoid measurement errors caused by the cooling effects of the

thermocouple wire.

References:

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134

USA

(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering

Documents at 800-854-7179 or 303-397-7956.

JEDEC specifications are available on the WEB at http://www.jedec.org.

●

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998,

pp. 47-54.

●

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled

Applications”, Electronic Packaging and Production, pp. 53-58, March 1998.

●

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal

Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San

Diego, 1999, pp. 212-220.

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