L6706TR datasheet(9/47 Pages) STMICROELECTRONICS

9 / 47 page

L6706

Pins description and connection diagrams

Doc ID 15698 Rev 2

9/47

2.2

Thermal data

Table 3.

Thermal data

UGATE

HS driver output.

It must be connected to the HS MOSFET gate. A small series resistors helps in

reducing device-dissipated power.

BOOT

HS driver supply.

Connect through a capacitor (100 nF typ.) to PHASE and provide necessary

Bootstrap diode. A small resistor in series to the boot diode helps in reducing

Boot capacitor overcharge.

PAD

Thermal

PAD

Exposed pad connects the silicon substrate. As a consequence it makes a

good thermal contact with the PCB to dissipate the power necessary to drive

the external MOSFETs.

Connect it to the power ground plane using 4.3 x 4.3 mm square area on the

PCB and with nine vias, to improve thermal conductivity.

Table 2.

Pin description (continued)

N°

Name

Description

Symbol

Parameter

Value

Unit

RthJA

Thermal resistance junction to ambient

(Device soldered on 2s2p PC board)

°C / W

RthJC

Thermal resistance junction to case

°C / W

TMAX

Maximum junction temperature

150

°C

Tstg

Storage temperature range

-40 to 150

°C

Junction temperature range

-10 to 125

°C

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