AS3517H-ECTP datasheet(12/94 Pages) AMSCO

12 / 94 page

AS3517 V17

Data Sheet, Confidential

www.austriamicrosystems.com

8 Absolute Maximum Ratings (Non-Operating)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings

only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device should be

operated under recommended operating conditions.

Table 3

Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Unit

Note

VIN_5V

5V pins

-0.5

7.0

Applicable for pins BVDD, BVDDH,

BVDDC1, BVDDC2, BVDDC3, BVDDR,

CHG_IN, VBUS

VIN_SW15

15V pin

-0.5

Applicable for pin SW15

VIN_VSS

Voltage difference at VSS

terminals

-0.5

0.5

Applicable for pins CVSS3, CVSS15,

CVSS1, CVSS2, VSSH, AVSS, DVSS

VIN_DVDD

3.3V pins with diode to DVDD

-0.5

5.0

DVDD+0.5

Applicable for pins LRCK, SCLK, SDI,

VPRG1, VPRG2, BATTEMP, ISINK,

XIN32, XOUT32, XIN24, XOUT24, XIRQ,

XRES, PWGD, Q32K, Q24M, HBT

VIN_xDVDD

pins with no diode to DVDD

-0.5

7.0V

Applicable for pins

CSCL, CSDA, PWRUP

VIN_AVDD

3.3V pins with diode to AVDD

-0.5

5.0

AVDD+0.5

Applicable for pins HPCM, HPGND,

LOUT1L/R, LOUT2L/R, VREF, AGND,

LIN1L/R, LIN2L/R, MIC1P/N, MIC2P/N,

MIC1S, MIC2S

VIN_REG

voltage regulator pins with

diodes to BVDD

-0.5

5.0

BVDD+0.5

Applicable for pins AVDD, DVDD,

PVDD1/2, CVDD1/2/3, UVDD

VIN_RVDD

voltage regulator pin with

diode to BVDD

-0.5

3.6

BVDD+0.5

Applicable for pins RVDD

VIN_BVDD

pins with diode to BVDD

-0.5

7.0

BVDD+0.5

Applicable for pins HPR/L, CHG_OUT

Iscr

Input Current (latchup

immunity)

-100

100

Norm: JEDEC 17

ESD

Electrostatic Discharge HBM

+/-1

Norm: JEDEC JESD22-A114C

Total Power Dissipation (all

supplies and outputs)

1000

BGA81, Tamb=70°C

Humidity non-condensing

Table 4

Soldering Conditions

Symbol

Parameter

Min

Max

Unit

Note

Tbody

Package Body Temperature

260

°C

Norm IPC/JEDEC J-STD-020C, reflects

moisture sensitivity level only

Tpeak

235

245

°C

Dwell

Solder Profile*

above 217 °C

* austriamicrosystems AG strongly recommends to use underfill.

Revision 1v3

- 93

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