R34DS0012EU0504 Rev.5.04

Page 6

Sep 18, 2025

ISL73141SEH Datasheet

3.

Specifications

3.1

Absolute Maximum Ratings

Caution: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such

conditions can adversely impact product reliability and result in failures not covered by warranty.

3.2

Recommended Operating Conditions

3.3

Thermal Specifications

Parameter

Min

Max

Unit

Supply Voltage (AVCC, DVCC)-0.3

6.4

V

Supply Voltage (AVCC)[1]

1. Tested in a heavy ion environment at LET = 86MeV•cm2/mg at 125°C.

-0.3

6.3

V

Supply Voltage (DVCC)[1]

-0.3

4.6

V

AIN, REF

-0.3

AVCC + 0.3

V

AIN, REF[1]

-0.3

5.1

V

Digital Input Voltage (PD, CS, SCK)

-0.3

DVCC + 0.3

V

Digital Output Voltage (BUSY, SDO)

-0.3

DVCC + 0.3

V

AIN Input Current[2]

2. When an input voltage exceeds maximum operating conditions (voltage at the AIN pin less than GND or greater than AVCC), limit the

input current to less than ±3mA.

-3

3

mA

Maximum Junction Temperature

-

+150

°C

Maximum Storage Temperature Range

-65

+150

°C

Human Body Model (Tested per MIL-STD-883 TM3015.7)

-

2.5

kV

Charged Device Model (Tested per JS-002-2014)

-

600

V

Parameter

Min

Max

Unit

Temperature

-55

+125

°C

Analog Supply Voltage, AVCC (ISL73141SEHMFN)

3.0

3.6

V

Analog Supply Voltage, AVCC (ISL73141SEHMF7)

4.5

5.5

V

Digital Supply Voltage, DVCC

2.2

3.6

V

Reference Input Voltage, VREF (ISL73141SEHMFN)

1.95

3.6

V

Reference Input Voltage, VREF (ISL73141SEHMF7)

3.9

4.2

V

Analog Input Voltage, AIN

0VREF

V

Parameter

Package

Symbol

Conditions

Typical

Value

Unit

Thermal Resistance

CDFP Package K14.A

θJA[1]

1. θJA is measured in free air with the component on high-effective thermal conductivity test board with direct attach features. See TB379.

Junction to ambient

34

°C/W

θJC[2]

2. For θJC, the case temperature location is the center of the package underside..

Junction to case

6

°C/W