ISL73141SEHF7SLASHPROTO datasheet(29/30 Pages) RENESAS

29 / 30 page

0.05(1.27)

BSC

0.390(9.91) Max

0.005(0.13)

0.370(9.40)

0.030(0.76)

Min

0.125(3.18) Min

0.022(0.56)

0.019(0.48)

0.009(0.23)

Section A-A

0.0015(0.04) Max

Base Metal

Lead

Finish

0.290(7.37) Max

1 Index area: A notch or a pin one identification mark shall be located adjacent to

pin one and shall be located within the shaded area shown. The manufacture's

identification shall not be used as a pin one identification mark.

Notes:

2 This dimension allows for off-center lid, meniscus, and glass overrun.

3 The maximum limits of lead dimensions (section A-A) shall be measured at

4 Measure dimension at all four corners.

5 For bottom-brazed lead packages, no organic or polymeric materials

shall be molded to the bottom of the package to cover the leads.

6 This dimension shall be measured at the point of exit (beyond the meniscus)

of the lead from the body. This dimension's minimum shall be reduced by

0.0015 inch (0.038mm) maximum when solder dip lead finish is applied.

7. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

8. Dimensions: INCH(mm). Controlling dimension: INCH.

Pin No.1

ID Area

0.004

H A-B

0.036

H A-B

-B-

-A-

-H-

-C-

-D-

0.260(6.60)

0.235(5.97)

0.045(1.14)

0.026(0.66)

0.270(6.86)

0.115(2.92)

0.045(1.14)

0.004(0.10)

0.015(0.38)

0.006(0.15)

0.004(0.10)

0.022(0.56)

0.015(0.38)

0.009(0.23)

0.004(0.10)

the centroid of the finished lead surfaces, when solder dip or tin plate finish

is applied.

9. Compliant to MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B).

Min

Top Vew

Side View

Package Outline Drawing

14 Lead Ceramic Metal Seal Flatpack Package

POD Number: K14.A, Revision no: 02, Date Created: Mar 4, 2025

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