TMS320F28076PZP datasheet(43/192 Pages) TI

tên linh kiện	TMS320F28076PZP

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(2)

lfm = linear feet per minute

7.8 Thermal Design Considerations

Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems that

exceed the recommended maximum power dissipation in the end product may require additional thermal

enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor

that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care

should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating

junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal

application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and

definitions.

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TMS320F28076, TMS320F28075

SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021

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TMS320F28076PZP bảng dữ liệu(PDF) 43 Page - Texas Instruments