TMS320F28375DPZP datasheet(39/222 Pages) TI1

39 / 222 page

TMS320F28379D, TMS320F28378D, TMS320F28377D

TMS320F28376D, TMS320F28375D, TMS320F28374D

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SPRS880K – DECEMBER 2013 – REVISED NOVEMBER 2018

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TMS320F28374D

Terminal Configuration and Functions

Table 4-1. Signal Descriptions (continued)

TERMINAL

I/O/Z(1)

DESCRIPTION

NAME

MUX

POSITION

ZWT

BALL

NO.

PTP

NO.

PZP

NO.

VSS

L10

PWR

PAD

PWR

PAD

Device ground. For Quad Flatpacks (QFPs), the

PowerPAD on the bottom of the package must be

soldered to the ground plane of the PCB.

L11

L12

L18

M10

M11

M12

M14

M15

P11

P12

P14

P15

R14

R15

W19

VSSOSC

H18

122

Crystal oscillator (X1 and X2) ground pin. When using an

external crystal, do not connect this pin to the board

ground. Instead, connect it to the ground reference of the

external crystal oscillator circuit.

If an external crystal is not used, this pin may be

connected to the board ground.

H19

–

VSSA

Analog ground.

On the PZP package, pin 17 is double-bonded to VSSA

and VREFLOA. This pin must be connect to VSSA.

–

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